|
Features |
| • Small beam diameter and fine marking line |
| • Good quality and high laser beam stability |
| • Complete machine stability, simple and easy
operation |
| • Narrow pulse width, small heat affected zone,
workpiece without damage |
| • Suitable for sensitive material as cold light
source |
| • Laser directly acting on molecular chain with
maximum extend to avoid thermal effect |
|
Applications |
|
• Flexible circuit board (FPC) marking,
cutting |
|
• Micro hole machining |
|
• Wafer scribing |
|
• Non removal of metal surface |
|
• Fine marking, a variety of polymer materials,
marking and micromachining |
